Comprehensive Exhaust‑gas Treatment (DPF+SCR) for Diesel Generator Sets in the Semiconductor Industry

Short Description:

Comprehensive Exhaust‑gas Treatment Solution (DPF+SCR) for Diesel Generator Sets in the Semiconductor Industry.

Custom‑tailored by Green Valley for the working conditions of standby generator sets in semiconductor plants.

The DPF efficiently captures particulate matter, while the SCR deeply reduces nitrogen oxides. The combined system achieves dual compliance for particulate matter and NOₓ. Featuring a compact structure, the equipment is suitable for retrofitting inside generator rooms. It meets stringent environmental standards of semiconductor factories and ensures stable and safe operation of data centers and chip manufacturing plants.

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Technical introduction

Exhaust Gas Treatment Project for Standby Diesel Generator Set in a Semiconductor Plant, Shanghai

Treatment Technology: DPF+SCR System

Generator: Cummins KTA50-G16A

Green Valley Equipment Model: GRVNES50-TX-16 & GRVNES50-CYJ-16-L

NOₓ: 3147 mg/Nm³ down to 200 mg/Nm³

Soot: ＜200 mg/Nm³ down to 30 mg/Nm³

The integrated DPF+SCR system realizes simultaneous removal of particulate matter and NOₓ. Customized for semiconductor plant standby generator rooms, it meets strict emission standards and ensures stable & safe operation of the chip manufacturing site.

Technical advantages

1、Excellent Purification Performance:Combined DPF+SCR technology realizes effective reduction of both NOₓ and soot, satisfying strict emission standards for semiconductor plants

2、Convenient & Cost‑saving Retrofit:Compact structure fits generator‑room layout. Major modification of existing facilities is avoided to shorten construction period and cut costs.

3、Good Working‑condition Adaptability:Optimized for intermittent and emergency start‑stop of standby generators, ensuring safe emergency power supply while meeting emission requirements.

4、Stable System Operation:High‑integrated complete‑set design ensures good compatibility between DPF and SCR units, avoiding separate‑component matching risks for long‑term reliable performance.